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SPI NAND Flash
FEATURES
■ X8 I/O BUS
－ NAND Interface
－ ADDRESS / DATA Multiplexing
■ SUPPLY VOLTAGE
－ VCC = 2.7-3.6 Volt core supply voltage for Program, Erase and Read operations
■ PAGE READ / PROGRAM
－ X8: (2048+64 spare) byte
－ Synchronous Page Read Operation
－ Random access: 25us (Max)
－ Serial access: 25ns (2.7/3.0V)
－ Page program time: 300us (Typ)
■ PAGE COPY BACK
－ Fast data copy without external buffering
■ CACHE PROGRAM
－ Internal buffer to improve the program throughput
■ READ CACHE
■ LEGACY/ONFI 1.0 COMMAND SET
■ FAST BLOCK ERASE
－ Block size (X8): (128K + 4K) bytes
－ Block erase time: 2ms (Typ)
■ MEMORY CELL ARRAY
－ X8: (2K + 64) bytes x 64 pages x 1024 blocks
■ ELECTRONIC SIGNATURE
－ Manufacturer Code
－ Device Code
■ STATUS REGISTER
■ HARDWARE DATA PROTECTION
■ DATA RETENTION
－ 50K Program / Erase cycles
－ Data retention: 10 Years (4bit/512byte ECC)
－ Block zero is a valid block and will be valid for at lea
| Type | Part Number | Density | Voltage（V） | Speed（MHz/CLK) | Temp.Range | PKG Type |
| SPI NAND | FMND1G08S3D-ID | 1G | 1.8V | 45ns | -40℃-85℃ | VFBGA63(9*11mm) |
| FMND1G08S3D-IF | -40℃-85℃ | VFGBA67(6.5*8mm) | ||||
| FMND1G08S3D-IW | -40℃-85℃ | KGD | ||||
| FMND1G08U3D-IA | 3.3V | 25ns | -40℃-85℃ | TSOP48(12*20mm) | ||
| FMND1G08U3D-ID | -40℃-85℃ | VFBGA63(9*11mm) | ||||
| FMND1G08U3D-IF | -40℃-85℃ | VFBGA63(9*11mm) | ||||
| FMND1G08U3D-IW | -40℃-85℃ | KGD | ||||
| FMND2G08S3D-ID | 2G | 1.8V | 45ns | -40℃-85℃ | VFBGA63(9*11mm) | |
| FMND2G08S3D-IF | -40℃-85℃ | VFGBA67(6.5*8mm) | ||||
| FMND2G08S3D-IW | -40℃-85℃ | KGD | ||||
| FMND2G08U3D-IA | 3.3V | 25ns | -40℃-85℃ | TSOP48(12*20mm) | ||
| FMND2G08S3D-ID | -40℃-85℃ | VFBGA63(9*11mm) | ||||
| FMND2G08S3D-IF | -40℃-85℃ | VFGBA67(6.5*8mm) | ||||
| FMND2G08S3D-IW | -40℃-85℃ | KGD | ||||
| FMND4G08U3J-IA | 4G | 3.3V | 25ns | -40℃-85℃ | TSOP48(12*20mm) | |
| FMND4G08U3J-ID | -40℃-85℃ | VFBGA63(9*11mm) |
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