ML-3865-3526-B1H1

ML-3865-3526-B1H1 is high performance bottom-port analog silicon microphone that 
receives the sound signal from the backside hole on PCB. By usingourown innovative
and unique MEMS silicon microphone chip design, MicroLink Senstech provides a 
series of packaged MEMS silicon microphones with compact size to achieve good
performance such as high SNR, high sensitivity, excellent reliability and broad 
frequency response. This series of MEMS microphones find wide applications in cell 
phones, tablets, wearable devices and other portable electronic devices.
The ML-3865-3526-B1H1 has a sensitivity of -38dBV/Pa(tolerance of ±1dBV/Pa) with 
a signal-to-noise ratio of 65 dB,an extreme low total harmonic distortion of 0.1% 
at 94 dB SPL and very high acoustic overload point of 123 dB SPL.

ML-3865-3526-B1H1 is high performance bottom-port analog silicon microphone that
receives the sound signal from the backside hole on PCB. By usingourown innovative
and unique MEMS silicon microphone chip design, MicroLink Senstech provides a
series of packaged MEMS silicon microphones with compact size to achieve good
performance such as high SNR, high sensitivity, excellent reliability and broad
frequency response. This series of MEMS microphones find wide applications in cell
phones, tablets, wearable devices and other portable electronic devices.
The ML-3865-3526-B1H1 has a sensitivity of -38dBV/Pa(tolerance of ±1dBV/Pa) with
a signal-to-noise ratio of 65 dB,an extreme low total harmonic distortion of 0.1%
at 94 dB SPL and very high acoustic overload point of 123 dB SPL.
 Features
 Gold coated metal housing package, immune to RF/EM interference.
 High mechanical strength, high temperature resistance and excellent
reliability.
 Wide frequency response range, high sensitivity and pretty good signal-to
noise ratio.
 Withstand multiple times of SMT reflow process.

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